IP Library Assignment 046981/0041
Patent Assignment
Reel/Frame 046981/0041

Assignment of Assignor's Interest

Recorded: 2018-09-26 Pages: 4
Assignors
HALL, MARK DOUGLAS
Executed: 2018-09-26
CIOSEK, WALTER J.
Executed: 2018-09-26
TIPPLE, DAVID RUSSELL
Executed: 2018-09-26
Assignee
NXP USA, INC.
6501 WILLIAM CANNON DRIVE WEST, AUSTIN, TEXAS, 78735
Covered Property (1)
Package to Die Connection System and Method Therefor
Application: 16/142,623 →
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 10, 2024
From: NXP USA, INC.
To: CHIP PACKAGING TECHNOLOGIES, LLC
Reel/Frame 068541/0903 →