IP Library Assignment 046992/0814
Patent Assignment
Reel/Frame 046992/0814

Assignment of Assignor's Interest

Recorded: 2018-09-27 Pages: 3
Assignors
MATSUDA, TOKIYOSHI
Executed: 2018-09-20
SHINOHE, TAKASHI
Executed: 2018-09-19
YAGYU, SHINGO
Executed: 2018-09-20
IGAWA, TAKUTO
Executed: 2018-09-25
Assignee
FLOSFIA INC.
1-36 GORYOOHARA, NISHIKYO-KU, KYOTO-SHI, KYOTO, 615-8245, JAPAN
Covered Property (1)
Layered Structure, Semiconductor Device Including Layered Structure, and Semiconductor System Including Semiconductor Device
Application: 16/143,757 →
Publication: US 2019/0103465
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Assignee Address Jun 6, 2019
From: FLOSFIA INC.
To: FLOSFIA INC.
Reel/Frame 049393/0558 →