Patent Assignment
Reel/Frame 046998/0095
Assignment of Assignor's Interest
Recorded: 2018-09-27
Pages: 3
Assignors
SUGAYA, ISAO
Executed: 2018-07-30
MITSUISHI, HAJIME
Executed: 2018-07-30
FUKUDA, MINORU
Executed: 2018-07-30
Assignee
NIKON CORPORATION
15-3, KONAN 2-CHOME, MINATO-KU, TOKYO, 1086290, JAPAN
Covered Property
(1)
Substrate Bonding Apparatus and Substrate Bonding Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.