Patent Assignment
Reel/Frame 047026/0362
Assignment of Assignor's Interest
Recorded: 2018-10-01
Pages: 5
Assignors
KANG, MYUNG SAM
Executed: 2018-08-29
KIM, JIN SU
Executed: 2018-08-29
PARK, YONG JIN
Executed: 2018-08-29
KO, YOUNG GWAN
Executed: 2018-08-29
SEOL, YONG JIN
Executed: 2018-08-29
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Integrating Active and Passive Components with Electromagnetic Shielding
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.