IP Library › Assignment 047053/0219
Patent Assignment
Reel/Frame 047053/0219

Assignment of Assignor's Interest

Recorded: 2018-10-03 Pages: 3
Assignors
WATANABE, TOMOYUKI
Executed: 2018-08-20
KOUZUMA, YUTAKA
Executed: 2018-08-21
TANDOU, TAKUMI
Executed: 2018-08-20
YOKOGAWA, KENETSU
Executed: 2018-08-20
ITO, HIROSHI
Executed: 2018-08-20
Assignee
HITACHI HIGH-TECHNOLOGIES CORPORATION
24-14, NISHI SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, 105-8717, JAPAN
Covered Property (1)
Wafer Processing Method and Wafer Processing Apparatus
Application: 16/110,081 →
Publication: US 2019/0198299
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 25, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052225/0894 →