Patent Assignment
Reel/Frame 047070/0189
Assignment of Assignor's Interest
Recorded: 2018-10-04
Pages: 10
Assignors
KWON, CHAN-SIK
Executed: 2018-08-28
PARK, JIN DUCK
Executed: 2018-08-28
JANG, JIN WOOK
Executed: 2018-09-17
HAN, JI-YEON
Executed: 2018-08-28
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Crack Detection Chip and Crack Detection Method Using the Same