Patent Assignment
Reel/Frame 047083/0326
Assignment of Assignor's Interest
Recorded: 2018-10-05
Pages: 7
Assignors
AHN, HAK-YOON
Executed: 2018-09-19
LEE, SANG-HYUN
Executed: 2018-09-18
KANG, SUNG-WOO
Executed: 2018-09-18
SHIN, HONG-SIK
Executed: 2018-09-19
OH, SEONG-HAN
Executed: 2018-09-18
OH, YOUNG-MOOK
Executed: 2018-09-18
LEE, IN-KEUN
Executed: 2018-09-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Devices and Methods of Manufacturing the Same