Integrated circuit devices and methods of manufacturing the same
A semiconductor device may include a substrate including a fin active region extending in a first direction, a gate structure crossing the fin active region and extending in a second direction crossing the first direction, source/drain regions on the fin active region at opposite sides of the gate structure, a first contact structure electrically connected to one of the source/drain regions, a pair of first contact block structures on opposite first sidewalls, respectively, of the first contact structure in the second direction.
1. An integrated circuit device comprising:
a substrate including a fin active region extending in a first direction;
a gate structure crossing the fin active region and extending in a second direction crossing the first direction;
source/drain regions on the fin active region at opposite sides of the gate structure;
a first contact structure electrically connected to one of the source/drain regions, the first contact structure comprising first and second sidewalls opposite each other in the second direction and a third sidewall adjacent the gate structure;
a pair of first contact block structures on the first and second sidewalls, respectively, of the first contact structure; and
an interlayer insulation layer on the gate structure, the interlayer insulation layer adjacent to the third sidewall of the first contact structure and adjacent to a fourth sidewall of each of the pair of first contact block structures in the first direction,
wherein at least one of the first contact block structures, in the pair of first contact block structures, has a width in the first direction that is greater than a width of the first contact structure in the first direction.
2. The device of claim 1 , wherein uppermost surfaces of the pair of first contact block structures are coplanar with an uppermost surface of the first contact structure.
3. The device of claim 1 , wherein each of the first and second sidewalls of the first contact structure contacts a fifth sidewall of a corresponding one of the pair of first contact block structures in the second direction.
4. The device of claim 1 , wherein lowermost surfaces of the pair of first contact block structures are positioned at a lower level with respect to the substrate than a level with respect to the substrate of an upper surface of the gate structure.
5. The device of claim 1 , further comprising an inter-gate insulation layer on a sidewall of the gate structure, wherein upper portions of the first and second sidewalls of the first contact structure contact a fifth sidewall of a corresponding one of the pair of first contact block structures in the second direction, and wherein lower portions of the first and second sidewalls of the first contact structure contact the inter-gate insulation layer.
6. The device of claim 1 , wherein the gate structure comprises:
a gate electrode that extends in the second direction; and
a gate spacer that is on a sidewall of the gate electrode and extends in the second direction, wherein the gate spacer contacts both of the pair of first contact block structures.
7. The device of claim 1 , wherein lowermost surfaces of the pair of first contact block structures are positioned at a higher level with respect to the substrate than a level with respect to the substrate of an uppermost surface of the gate structure.
8. The device of claim 1 , wherein ones each of the pair of first contact block structures contact a respective one of the first and second sidewalls of the first contact structure and respectively extend from an uppermost portion of the respective one of the first and second sidewalls of the first contact structure to a lowermost portion of the respective one of the first and second sidewalls of the first contact structure.
9. The device of claim 8 , wherein lowermost surfaces of the pair of first contact block structures are positioned at a same level with respect to the substrate as a level with respect to the substrate of a lowermost surface of the gate structure.
10. The device of claim 1 , further comprising:
a second contact structure connected to the gate structure; and
a pair of second contact block structures on opposite sidewalls of the second contact structure in the first direction.
11. The device of claim 10 , wherein uppermost surfaces of the pair of second contact block structures are coplanar with an uppermost surface of the second contact structure.
12. An integrated circuit device comprising:
a substrate including a fin active region extending in a first direction;
a plurality of gate structures crossing the fin active region and extending in a second direction crossing the first direction;
a source/drain region on the fin active region between adjacent ones of the gate structures;
a first contact structure on the source/drain region, between the adjacent ones of the gate structures; and
a pair of first contact block structures on opposite sidewalls, respectively, of the first contact structure, between the adjacent ones of the gate structures,
wherein the pair of first contact block structures are spaced apart from each other in the second direction, and
wherein at least one of the first contact block structures, in the pair of first contact block structures, has a width in the first direction that is greater than a width of the first contact structure in the first direction.
13. The device of claim 12 , wherein each of the first contact block structures, in the pair of first contact block structures contacts a corresponding one of the opposite sidewalls of the first contact structure.
14. The device of claim 12 , further comprising an inter-gate insulation layer between the adjacent ones of the gate structures, wherein upper portions of the opposite sidewalls of the first contact structure contact corresponding one of the pair of first contact block structures, respectively, and wherein lower portions of the opposite sidewalls of the first contact structure contact the inter-gate insulation layer.
15. An integrated circuit device comprising:
a substrate including a fin active region extending in a first direction;
a plurality of gate structures crossing the fin active region and extending in a second direction crossing the first direction;
a source/drain region on the fin active region between two adjacent ones of the gate structures;
a first contact structure on the source/drain region, between the two adjacent ones of the gate structures;
a pair of first contact block structures on opposite sidewalls, respectively, of the first contact structure, between the two adjacent ones of the gate structures; and
an interlayer insulation layer on the plurality of gate structures, the interlayer insulation layer contacting the pair of first contact block structures and the first contact structure,
wherein at least one of the first contact block structures, in the pair of first contact block structures, has a width in the first direction that is greater than a width of the first contact structure in the first direction.
16. The device of claim 15 , further comprising an inter-gate insulation layer between the adjacent ones of the gate structures,
wherein upper portions of the opposite sidewalls of the first contact structure contact a corresponding one of the pair of first contact block structures, and
wherein lower portions of the opposite sidewalls of the first contact structure contact the inter-gate insulation layer.
17. The device of claim 15 , wherein each of the gate structures includes a gate electrode extending in the second direction and a gate spacer on a sidewall of the gate electrode, and
wherein the pair of first contact block structures contact the gate spacer of each of the two adjacent ones of the gate structures.
18. The device of claim 17 , wherein lowermost surfaces of the pair of first contact block structures are positioned at a lower level with respect to the substrate than a level with respect to the substrate of uppermost surfaces of the gate structures.