Patent Assignment
Reel/Frame 047090/0756
Assignment of Assignor's Interest
Recorded: 2018-10-08
Pages: 6
Assignors
CHEN, HOWARD E.
Executed: 2018-04-26
VIVEIROS, DAVID, JR.
Executed: 2018-05-22
REISNER, RUSS ALAN
Executed: 2018-05-22
DARVEAUX, ROBERT FRANCIS
Executed: 2018-04-26
Assignee
SKYWORKS SOLUTIONS, INC.
20 SYLVAN ROAD, WOBURN, MASSACHUSETTS, 01801
Covered Property
(1)
Packaged Module having a Ball Grid Array with Grounding Shielding Pins for Electromagnetic Isolation, Method of Manufacturing the same, and Wireless Device comprising the same