Packaged module having a ball grid array with grounding shielding pins for electromagnetic isolation, method of manufacturing the same, and wireless device comprising the same
Signal isolation for module with ball grid array. In some embodiments, a packaged module can include a packaging substrate having an underside, and an arrangement of conductive features implemented on the underside of the packaging substrate to allow the packaged module to be capable of being mounted on a circuit board. The arrangement of conductive features can include a signal feature implemented at a first region and configured for passing of a signal, and one or more shielding features placed at a selected location relative to the signal feature to provide an enhanced isolation between the signal feature and a second region of the underside of the packaging substrate.
1. A packaged module comprising:
a packaging substrate having an upper side and an underside;
an upper-side component mounted on the upper side of the packaging substrate;
an overmold implemented on the upper side of the packaging substrate and dimensioned to encapsulate the upper-side component;
first and second underside components mounted to the underside of the packaging substrate; and
a ball grid array implemented on the underside of the packaging substrate to accommodate the first and second underside components and to allow the packaged module to be mounted on a circuit board, the ball grid array including a signal pin for passing of a signal, a plurality of non-ground pins, and a plurality of grounding shielding pins arranged to provide electromagnetic isolation between the signal pin and either or both of the first and second underside components, to provide electromagnetic isolation between the signal pin and another signal pin of the ball grid array, and to provide electromagnetic isolation between the first underside component and the second underside component, the ball grid array arranged such that one or more of the non-ground pins is/are positioned immediately next to a side of at least one of the first and second components.
2. The packaged module of claim 1 wherein each of the plurality of grounding shielding pins includes a solder ball.
3. The packaged module of claim 1 wherein at least one of the first and second underside components includes a semiconductor die or a surface-mount technology (SMT) device.
4. The packaged module of claim 1 wherein the packaged module is a dual-sided module having the ball grid array.
5. The packaged module of claim 4 wherein at least one of the first and second underside components and the upper-side component is implemented to be a part of a radio-frequency circuit.
6. The packaged module of claim 1 further comprising a conformal shield layer implemented to cover an upper surface of the overmold and side walls defined by the overmold and the packaging substrate.
7. A method for manufacturing a packaged module, the method comprising:
forming or providing a packaging substrate having an upper side and an underside;
mounting an upper-side component on the upper side of the packaging substrate;
implementing an overmold on the upper side of the packaging substrate to encapsulate the upper-side component;
arranging a ball grid array on the underside of the packaging substrate to define first and second mounting regions; and
mounting first and second underside components within the first and second mounting regions, respectively, such that the ball grid array allows the packaged module to be mounted on a circuit board, and such that the ball grid array includes a signal pin for passing of a signal, a plurality of non-ground pins, and a plurality of grounding shielding pins arranged to provide electromagnetic isolation between the signal pin and either or both of the first and second underside components, to provide electromagnetic isolation between the signal pin and another signal pin of the ball grid array, and to provide electromagnetic isolation between the first underside component and the second underside component, the ball grid array arranged such that one or more of the non-ground pins is/are positioned immediately next to a side of at least one of the first and second components.
8. A wireless device comprising:
a circuit board configured to receive a plurality of modules;
a transceiver implemented on the circuit board;
an antenna in communication with the transceiver and configured to support either or both of transmission and reception of respective signals; and
a radio-frequency module mounted on the circuit board with a ball grid array of the radio-frequency module such that the radio-frequency module is electrically between the transceiver and the antenna, the radio-frequency module including a packaging substrate having an upper side and an underside with the ball grid array implemented on the underside of the packaging substrate, the radio-frequency module further including an upper-side component mounted to the upper side of the packaging substrate, an overmold implemented on the upper side of the packaging substrate and dimensioned to encapsulate the upper-side component, and first and second underside components mounted to the underside of the packaging substrate, the ball grid array including a signal pin for passing of a signal, a plurality of non-ground pins, and a plurality of grounding shielding pins arranged to provide electromagnetic isolation between the signal pin and either or both of the first and second underside components, to provide electromagnetic isolation between the signal pin and another signal pin of the ball grid array, and to provide electromagnetic isolation between the first underside component and the second underside component, the ball grid array arranged such that one or more of the non-ground pins is/are positioned immediately next to a side of at least one of the first and second components.