Patent Assignment
Reel/Frame 047095/0799
Assignment of Assignor's Interest
Recorded: 2018-10-08
Pages: 5
Assignors
SAGAWA, MASAKAZU
Executed: 2018-08-20
MORIKAWA, TAKAHIRO
Executed: 2018-08-28
MIYATA, MOTOYUKI
Executed: 2018-08-08
YASUI, KAN
Executed: 2018-08-30
MORITA, TOSHIAKI
Executed: 2018-08-28
Assignee
HITACHI POWER SEMICONDUCTOR DEVICE, LTD.
2-2, OMIKA-CHO 5-CHOME, HITACHI-SHI, IBARAKI, 319-1221, JAPAN
Covered Property
(1)
Semiconductor Chip and Power Module, and Manufacturing Method of the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.