Patent Assignment
Reel/Frame 047102/0412
Assignment of Assignor's Interest
Recorded: 2018-09-18
Pages: 4
Assignors
CHEN, FEIBIAO
Executed: 2018-08-24
GE, YAPING
Executed: 2018-08-24
GUO, SONG
Executed: 2018-08-24
QI, JINGCHAO
Executed: 2018-08-24
Assignee
SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
1525 ZHANGDONG ROAD, ZHANGJIANG HIGH-TECH PARK, SHANGHAI, 201203, CHINA
Covered Property
(1)
Flip Chip Bonding Device and Bonding Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.