Patent Assignment
Reel/Frame 072912/0466
Assignment of Assignor's Interest
Recorded: 2025-09-17
Pages: 9
Assignor
SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
Executed: 2025-06-25
Assignee
AMIES TECHNOLOGY CO., LTD.
3RD FLOOR, BUILDING 19, BLOCK 8, 498 GUOSHOUJING ROAD, CHINA (SHANGHAI) PILOT FREE TRADE ZONE, PUDONG NEW AREA, SHANGHAI, 201203, CHINA
Covered Properties
(62)
Large-Field Unit-Magnification Projection Optical System
Backside Alignment Apparatus and Method
Laser Annealing Apparatus and Laser Annealing Method
Linear Motor and Stage Apparatus
Silicon Wafer Edge Protection Device with Collision Protection Function
Focusing Leveling Device
Silicon Wafer Pre-alignment Device and Method Therefor
Lithography Machine Workpiece Table and Vertical Position Initialization Method Thereof
Exposure Device and Out-of-Focus and Tilt Error Compensation Method
Adjusting Device and Adjusting Method for Exposure Device
Wafer Processing Device and Method Therefor
Silicon Wafer Edge Protection Device
Adaptive Groove Focusing and Leveling Device and Method
Mask Transmission Device and Transmission Method
Exposure Device
Exposure Apparatus and Method
Apparatus and Method for Transferring a Substrate
Apparatus for Detecting Degree of Particulate Contamination on Flat Panel
Reaction Force Diversion Mechanism, Motor Device and Photolithography Machine
Automatic Optical Inspection Method
Prism Rotation Adjustment Mechanism, Stepper Exposure System, and Stepper
Light-Spot Distribution Structure, Surface Shape Measurement Method, and Method for Calculating Exposure Field-of-View Control Value
Chip Bonding Apparatus and Method
Pattern Structure and Exposure Method of Patterned Sapphire Substrate Mask
Flip Chip Bonding Device and Bonding Method
Projection Exposure Apparatus and Method
Coaxial Mask Alignment Device, Photolithography Apparatus and Alignment Method
Light Intensity Modulation Method
Dual-Layer Alignment Device and Method
Bonding Device
Robot Arm for Holding Cassette and Automatic Cassette Transfer Device
Wafer Box Conveyor
Substrate Transfer Device, Transfer Method and Photolithography Apparatus
Knife Edge Set of Mask Aligner, Large-View-Field Mask Aligner, and Exposure Method
Automatic Optical Inspection Device and Method
A Chip Bonding Device and Bonding Method Thereof
Light Alignment Control Method and Light Alignment Device
Edge Exposure Device and Method
Machine Vision System for Substrate Alignment and Alignment Device
De-Bonding Leveling Device and De-Bonding Method
Device and Method for Bonding Alignment
Lens Contamination Prevention Device and Method
Chip Bonding Apparatus and Bonding Method
Batch Bonding Apparatus and Bonding Method
Optical Measurement Device and Method with Improved Measurement Precision
Rewiring Method for Semiconductor
Optical Measurement Device and Method
Universal Chip Batch-Bonding Apparatus and Method
Chip Defect Detection Device and Detection Method
System and Method for Controlling Exposure Dose of Light Source
Shutter Device, Method of Controlling Same, Photolithography Machine, and Method of Controlling Exposure Dose Thereof
Chip Bonding Device
Vertical Control Method for Use in Lithography Machine
Photoetching Apparatus and Method
Wafer Holder and Wafer Transfer Apparatus, System and Method
Shutter Device
Silicon Wafer Processing Device and Method
Vacuumizing Device and Vacuumizing Method for Bonding Substrate
Semiconductor Manufacturing Apparatus
Exposure Equipment and Exposure Method
Mask Fork for Transferring Mask, and Corresponding Mask Box and Mask Transferring Method
Linear Module and Operating Method Thereof
Related Assignments
(20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 28, 2008
From: LI, TIEJUN; HUANG, LING; WEI, JUN
To: SHANGHAI MICRO ELECTRONICS EQUIPMENT CO., LTD.
Reel/Frame 021899/0001 →
Assignment of Assignor's Interest
Jun 27, 2013
From: XU, BING; CHEN, YUEFEI; JIA, XIANG; YANG, XIAOQING
To: SHANGHAI MICRO ELECTRONICS EQUIPMENT CO., LTD.
Reel/Frame 030697/0769 →
Assignment of Assignor's Interest
Sep 15, 2014
From: ZHANG, JUN; LI, ZHIDAN; LI, ZHE
To: SHANGHAI MICRO ELECTRONICS EQUIPMENT CO., LTD.
Reel/Frame 033743/0334 →
Assignment of Assignor's Interest
Dec 19, 2014
From: WU, LIWEI; CHEN, QINGSHENG; YAN, LANZHOU
To: SHANGHAI MICRO ELECTRONICS EQUIPMENT CO., LTD
Reel/Frame 034560/0830 →
Assignment of Assignor's Interest
Jun 24, 2016
From: HUANG, JINGLI; ZHU, YUEBIN
To: SHANGHAI MICRO ELECTRONICS EQUIPMENT CO.,LTD.
Reel/Frame 039006/0436 →
Assignment of Assignor's Interest
Jul 5, 2016
From: SUN, WEIWANG; WANG, GANG; HUANG, CHUNXIA; HU, SONGLI
To: SHANGHAI MICRO ELECTRONICS EQUIPMENT CO., LTD
Reel/Frame 039074/0557 →
Assignment of Assignor's Interest
Jul 6, 2016
From: SONG, HAIJUN; LU, KAN; CHEN, FEIBIAO
To: SHANGHAI MICRO ELECTRONICS EQUIPMENT CO., LTD
Reel/Frame 039083/0084 →
Assignment of Assignor's Interest
Oct 20, 2016
From: LIAO, FEIHONG; ZHU, YUEBIN; JIA, HAILI; HU, SHUPING
To: SHANGHAI MICRO ELECTRONICS EQUIPMENT CO.,LTD.
Reel/Frame 040080/0616 →
Assignment of Assignor's Interest
Mar 31, 2017
From: CHEN, FEIBIAO; ZHOU, CHANG; CHEN, YUEFEI; CHENG, QI
To: SHANGHAI MICRO ELECTRONICS EQUIPMENT CO., LTD.
Reel/Frame 041805/0929 →
Assignment of Assignor's Interest
May 3, 2017
From: SUN, JINGLU
To: SHANGHAI MICRO ELECTRONICS EQUIPMENT CO., LTD.
Reel/Frame 042262/0181 →
Change of Name
Jun 30, 2017
From: SHANGHAI MICRO ELECTRONICS EQUIPMENT CO., LTD.
To: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
Reel/Frame 043517/0989 →
Assignment of Assignor's Interest
Jul 6, 2017
From: ZHOU, XU; CUI, HAICANG; NI, FEI; GE, LILI
To: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
Reel/Frame 042921/0800 →
Assignment of Assignor's Interest
Jul 6, 2017
From: QI, JINGCHAO; CHEN, FEIBIAO
To: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
Reel/Frame 042921/0570 →
Assignment of Assignor's Interest
Aug 29, 2017
From: JIANG, XIAOYU; WANG, CHANGGANG
To: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
Reel/Frame 043709/0204 →
Assignment of Assignor's Interest
Sep 28, 2017
From: WANG, GANG; TIAN, CUIXIA; JIANG, JIE; WANG, SHAOYU
To: SHANGHAI MICRO ELECTRONICS EQUIPMENT CO.,LTD.
Reel/Frame 043730/0465 →
Change of Name
Sep 28, 2017
From: SHANGHAI MICRO ELECTRONICS EQUIPMENT CO., LTD.
To: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
Reel/Frame 044837/0641 →
Assignment of Assignor's Interest
Nov 27, 2017
From: SUN, JINGLU; ZHOU, JIAN
To: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
Reel/Frame 044511/0476 →
Assignment of Assignor's Interest
Feb 28, 2018
From: XIE, RENBIAO; YANG, ZHIYONG; BAI, ANGLI; WANG, JIAN
To: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
Reel/Frame 045468/0973 →
Assignment of Assignor's Interest
Mar 6, 2018
From: LIANG, XIAO; LI, YANG
To: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
Reel/Frame 045506/0011 →
Corrective Assignment to Correct the Application Serial Number Previously Recorded at Reel: 043517 Frame: 0989. Assignor(S) Hereby Confirms the Assignment.
Mar 29, 2019
From: SHANGHAI MICRO ELECTRONICS EQUPIMENT CO., LTD.
To: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
Reel/Frame 048745/0860 →