IP Library Assignment 039074/0557
Patent Assignment
Reel/Frame 039074/0557

Assignment of Assignor's Interest

Recorded: 2016-07-05 Pages: 6
Assignors
SUN, WEIWANG
Executed: 2016-06-22
WANG, GANG
Executed: 2016-06-22
HUANG, CHUNXIA
Executed: 2016-06-22
HU, SONGLI
Executed: 2016-06-22
JIANG, JIE
Executed: 2016-06-22
LU, RUZHAN
Executed: 2016-06-22
MOU, JIYUAN
Executed: 2016-06-22
Assignee
SHANGHAI MICRO ELECTRONICS EQUIPMENT CO., LTD
1525 ZHANGDONG ROAD, ZHANGJIANG HIGH-TECH PARK, SHANGHAI, 201203, CHINA
Covered Property (1)
Silicon Wafer Pre-alignment Device and Method Therefor
Application: 15/109,040 →
Publication: US 2016/0329229
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jun 30, 2017
From: SHANGHAI MICRO ELECTRONICS EQUIPMENT CO., LTD.
To: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
Reel/Frame 043517/0989 →
Corrective Assignment to Correct the Application Serial Number Previously Recorded at Reel: 043517 Frame: 0989. Assignor(S) Hereby Confirms the Assignment. Mar 29, 2019
From: SHANGHAI MICRO ELECTRONICS EQUPIMENT CO., LTD.
To: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
Reel/Frame 048745/0860 →
Assignment of Assignor's Interest Sep 17, 2025
From: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
To: AMIES TECHNOLOGY CO., LTD.
Reel/Frame 072912/0466 →