Patent Assignment
Reel/Frame 047118/0693
Assignment of Assignor's Interest
Recorded: 2018-10-10
Pages: 5
Assignors
TANAKA, KENJI
Executed: 2018-08-28
YOSHIDA, YUKA
Executed: 2018-08-27
KOSUGI, SHINICHI
Executed: 2018-09-11
TANAKA, SHINGO
Executed: 2018-09-06
KATAGI, HIDEYUKI
Executed: 2018-08-29
SUE, HARUAKI
Executed: 2018-09-13
TAKEZAWA, YOSHITAKA
Executed: 2018-09-04
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Epoxy Resin Molding Material, Molded Product, Molded Cured Product, and Method for Producing Molded Cured Product
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Nov 11, 2020
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 054385/0268 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →