Patent Assignment
Reel/Frame 054385/0268
Change of Name
Recorded: 2020-11-11
Pages: 32
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Epoxy Resin Molding Material, Molded Product, Molded Cured Product, and Method for Producing Molded Cured Product
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 10, 2018
From: TANAKA, KENJI; YOSHIDA, YUKA; KOSUGI, SHINICHI; TANAKA, SHINGO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 047118/0693 →
Change of Name
Mar 8, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062992/0805 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →