IP Library › Assignment 047126/0327
Patent Assignment
Reel/Frame 047126/0327

Assignment of Assignor's Interest

Recorded: 2018-10-10 Pages: 5
Assignors
HUANG, CHIH-FAN
Executed: 2018-09-18
KAO, HUNG-CHAO
Executed: 2018-09-18
KAO, YUAN-CHAO
Executed: 2018-09-18
HSIAO, TSUNG-CHIEH
Executed: 2018-09-18
SHEN, HSIANG-KU
Executed: 2018-09-18
CHEN, HUI-CHI
Executed: 2018-09-25
CHEN, DIAN-HAU
Executed: 2018-09-25
CHEN, YEN-MING
Executed: 2018-09-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Metal-Insulator-Metal Structure and Methods of Fabrication Thereof
Application: 16/156,779 →
Publication: US 2020/0035779
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Third Inventor Name Previously Recorded at Reel: 047126 Frame: 0324. Assignor(S) Hereby Confirms the Assignment. Jan 23, 2019
From: HUANG, CHIH-FAN; KAO, HUNG-CHAO; HSIAO, YUAN-YANG; HSIAO, TSUNG-CHIEH
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 048117/0623 →