Patent Assignment
Reel/Frame 047136/0489
Assignment of Assignor's Interest
Recorded: 2018-10-11
Pages: 4
Assignor
JIN, HAN NA
Executed: 2018-09-19
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Carrier Substrate and Method of Manufacturing Semiconductor Package Using the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.