Patent Assignment
Reel/Frame 047163/0267
Assignment of Assignor's Interest
Recorded: 2018-10-15
Pages: 2
Assignor
INOUE, HAJIME
Executed: 2015-04-22
Assignee
HENKEL JAPAN LTD.
2-2-8 HIGASHI SHINAGAWA, SHINAGAWA-KU, TOKYO, JAPAN
Covered Property
(1)
Sinterable Bonding Material and Semiconductor Device Using the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 15, 2018
From: HENKEL JAPAN LTD.
To: HENKEL AG & CO. KGAA
Reel/Frame 047163/0330 →
Assignment of Assignor's Interest
Oct 15, 2018
From: TAKANO, TADASHI
To: HENKEL IP & HOLDING GMBH
Reel/Frame 047163/0570 →
Assignment of Assignor's Interest
Mar 9, 2022
From: HENKEL IP & HOLDING GMBH
To: HENKEL AG & CO. KGAA
Reel/Frame 059357/0267 →