Patent Assignment
Reel/Frame 047163/0570
Assignment of Assignor's Interest
Recorded: 2018-10-15
Pages: 3
Assignor
TAKANO, TADASHI
Executed: 2017-06-19
Assignee
HENKEL IP & HOLDING GMBH
HENKELSTRASSE 67, DUESSELDORF, 40589, GERMANY
Covered Property
(1)
Sinterable Bonding Material and Semiconductor Device Using the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 15, 2018
From: INOUE, HAJIME
To: HENKEL JAPAN LTD.
Reel/Frame 047163/0267 →
Assignment of Assignor's Interest
Oct 15, 2018
From: HENKEL JAPAN LTD.
To: HENKEL AG & CO. KGAA
Reel/Frame 047163/0330 →
Assignment of Assignor's Interest
Mar 9, 2022
From: HENKEL IP & HOLDING GMBH
To: HENKEL AG & CO. KGAA
Reel/Frame 059357/0267 →