Patent Assignment
Reel/Frame 047172/0637
Assignment of Assignor's Interest
Recorded: 2018-10-01
Pages: 3
Assignee
DIDREW TECHNOLOGY (BVI) LIMITED
2880 ZANKER ROAD, SUITE 210, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Large Panel Wafer Level Packaging With Stiffener
Application:
62/632,138 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 2, 2018
From: DIDREW TECHNOLOGY (BVI) LIMITED
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
Reel/Frame 047398/0987 →
Assignment of Assignor's Interest
Feb 21, 2019
From: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.; BEIJING ESWIN TECHNOLOGY CO., LTD.
Reel/Frame 048402/0107 →
Assignment of Assignor's Interest
Nov 19, 2019
From: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.; BEIJING ESWIN TECHNOLOGY CO., LTD.
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
Reel/Frame 051058/0408 →
Assignment of Assignor's Interest
Nov 4, 2022
From: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
To: CHENGDU ESWIN SYSTEM IC CO., LTD.
Reel/Frame 061658/0715 →