Patent Assignment
Reel/Frame 061658/0715
Assignment of Assignor's Interest
Recorded: 2022-11-04
Pages: 6
Assignor
CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
Executed: 2022-10-28
Assignee
CHENGDU ESWIN SYSTEM IC CO., LTD.
NO. 12, SHANGYANG ST. HIGH TECH DISTRICT, WEST CHENGDU CITY, 611731, CHINA
Covered Properties
(32)
Debonding temporarily bonded carrier-workpiece pair by comination chemical and mechanical methods
Application:
62/601,196 →
Method of debonding a temporarily bonded carrier-workpiece pair
Application:
62/601,289 →
Embedded Driver IC(EmDIC) in LCD Display
Application:
62/599,568 →
Chip in Glass for LCD Display (LCDCiG)
Application:
62/613,717 →
Chip in Glass for LCD Display (LCDCiG)
Application:
62/626,437 →
Molded Cavity Fanout
Application:
62/628,500 →
No TIM Hermetic Flat top IHS/EMI shield
Application:
62/631,134 →
Large Panel Wafer Level Packaging Process
Application:
62/631,305 →
Large Panel Wafer Level Packaging With Stiffener
Application:
62/632,138 →
Glass frame fan out packaging
Application:
62/632,162 →
Adhesive Composition for Temporary Bonding of Workpiece and Carrier Pair with Reduced Defects
Application:
62/640,527 →
Adhesive Composition for Temporary Bonding of Workpiece and Carrier Pair with Enhanced Adhesion
Application:
62/640,529 →
Thin Subject Assisted Debonding Method for Separating Temporary Adhesive Bonded Workpiece-Carrier
Application:
62/645,184 →
Glass Frame Fan Out Packaging and Method of Manufacturing Thereof
Application:
15/934,700 →
Publication:
US 2019/0259675
Embedded Molding Fan-Out (Emfo) Packaging and Method of Manufacturing Thereof
Application:
16/817,388 →
Publication:
US 2021/0287953
Interposer Structure Containing Embedded Silicon-Less Link Chiplet
Method for Debonding Temporarily Adhesive-Bonded Carrier-Workpiece Pair by Using Chemical and Mechanical Means
Method for Debonding Temporarily Adhesive-Bonded Carrier-Workpiece Pair by Using High Pressure Solvent
SYSTEM AND METHOD OF EMBEDDING DRIVER IC (EmDIC) IN LCD DISPLAY SUBSTRATE
Patent:
10,209,542 →
Application:
15/958,797 →
System and Method of Manufacturing Frameless Lcd Display
Patent:
10,209,597 →
Application:
15/959,125 →
Molded Cavity Fanout Package Without Using a Carrier and Method of Manufacturing the Same
Patent:
10,347,509 →
Application:
15/940,878 →
Hermetic Flat Top Integrated Heat Spreader (Ihs) / Electromagnetic Interference (Emi) Shield Package and Method of Manufacturing Thereof for Reducing Warpage
Multiple Wafers Fabrication Technique on Large Carrier with Warpage Control Stiffener
Method of Debonding Work-Carrier Pair with Thin Devices
Adhesive Composition for Temporary Bonding of Semiconductor Workpiece and Support Carrier Pair
Method and System for Debonding Temporarily Adhesive-Bonded Carrier-Workpiece Pair
PCT:
PCT/US2018/021634 ↗
System and Method of Embedding Driver Ic (Emdic) in Lcd Display Substrate
PCT:
PCT/US2018/028627 ↗
Frameless Lcd Display with Embedded Ic System and Method of Manufacturing Thereof
PCT:
PCT/US2018/028689 ↗
Method of Manufacturing Fan Out Package with Carrier-Less Molded Cavity
PCT:
PCT/US2018/025286 ↗
System and Method of Fabricating Tim-Less Hermetic Flat Top Ihs/Emi Shield Package
PCT:
PCT/US2018/028444 ↗
Method of Simultaneously Fabricating Multiple Wafers on Large Carrier with Warpage Control Stiffener
PCT:
PCT/US2018/024051 ↗
System and Method of Fabricating Glass Frame Fan Out Packaging
PCT:
PCT/US2018/024153 ↗
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 26, 2018
From: SHEN, MINGHAO; ZHOU, XIAOTIAN
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 045353/0115 →
Assignment of Assignor's Interest
Mar 26, 2018
From: SHEN, MINGHAO; DU, XIAOMING
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 045353/0134 →
Assignment of Assignor's Interest
Apr 3, 2018
From: SHEN, MINGHAO
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 045424/0573 →
Assignment of Assignor's Interest
Apr 18, 2018
From: ZHANG, CHUNBIN
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 045580/0367 →
Assignment of Assignor's Interest
Apr 18, 2018
From: ZHANG, CHUNBIN
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 045580/0329 →
Assignment of Assignor's Interest
Apr 18, 2018
From: ZHANG, CHUNBIN
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 045580/0321 →
Assignment of Assignor's Interest
Apr 23, 2018
From: SHEN, MINGHAO; ZHOU, XIAOTIAN; HU, YINJIANG; ZOU, SHAOLIN
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 046450/0137 →
Assignment of Assignor's Interest
Apr 23, 2018
From: SHEN, MINGHAO
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 045613/0705 →
Assignment of Assignor's Interest
Apr 23, 2018
From: SHEN, MINGHAO; ZHOU, XIAOTIAN; HU, YIJIANG; ZOU, SHAOLIN
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 046450/0123 →
Assignment of Assignor's Interest
Apr 27, 2018
From: ZHANG, CHUNBIN; ZHOU, XIAOTIAN
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 045654/0320 →
Assignment of Assignor's Interest
Oct 1, 2018
From: ZHANG, CHUNBIN; ZHOU, XIAOTIAN
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 047025/0969 →
Assignment of Assignor's Interest
Oct 1, 2018
From: SHEN, MINGHAO; ZHOU, XIAOTIAN
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 047172/0627 →
Assignment of Assignor's Interest
Oct 1, 2018
From: SHEN, MINGHAO
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 047172/0630 →
Assignment of Assignor's Interest
Oct 1, 2018
From: SHEN, MINGHAO; ZHOU, XIAOTIAN
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 047172/0637 →
Assignment of Assignor's Interest
Oct 1, 2018
From: SHEN, MINGHAO; DU, XIAOMING
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 047631/0306 →
Assignment of Assignor's Interest
Oct 1, 2018
From: SHEN, MINGHAO
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 047025/0862 →
Assignment of Assignor's Interest
Oct 1, 2018
From: ZHANG, CHUNBIN
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 047025/0832 →
Assignment of Assignor's Interest
Oct 1, 2018
From: SHEN, MINGHAO
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 047025/0529 →
Assignment of Assignor's Interest
Oct 1, 2018
From: ZHANG, CHUNBIN; ZHOU, XIAOTIAN; SHEN, MINGHAO; HU, YIJIANG
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 047172/0657 →
Assignment of Assignor's Interest
Oct 1, 2018
From: ZHANG, CHUNBIN; ZHOU, XIAOTIAN; SHEN, MINGHAO; ZOU, SHAOLIN
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 047631/0309 →
Assignment of Assignor's Interest
Oct 1, 2018
From: ZHANG, CHUNBIN
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 047025/0934 →
Assignment of Assignor's Interest
Oct 1, 2018
From: ZHANG, CHUNBIN
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 047025/0954 →
Assignment of Assignor's Interest
Oct 1, 2018
From: SHEN, MINGHAO; ZHOU, XIAOTIAN
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 047025/0870 →
Assignment of Assignor's Interest
Nov 2, 2018
From: DIDREW TECHNOLOGY (BVI) LIMITED
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
Reel/Frame 047398/0987 →
Assignment of Assignor's Interest
Feb 21, 2019
From: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.; BEIJING ESWIN TECHNOLOGY CO., LTD.
Reel/Frame 048402/0107 →