Patent Assignment
Reel/Frame 047172/0630
Assignment of Assignor's Interest
Recorded: 2018-10-01
Pages: 3
Assignor
SHEN, MINGHAO
Executed: 2018-05-05
Assignee
DIDREW TECHNOLOGY (BVI) LIMITED
2880 ZANKER ROAD, SUITE 210, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Large Panel Wafer Level Packaging Process
Application:
62/631,305 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 27, 2022
From: DIDREW TECHNOLOGY (BVI) LIMITED
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
Reel/Frame 058795/0321 →
Assignment of Assignor's Interest
Feb 16, 2022
From: DIDREW TECHNOLOGY (BVI) LIMITED
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
Reel/Frame 059168/0448 →
Assignment of Assignor's Interest
Nov 4, 2022
From: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
To: CHENGDU ESWIN SYSTEM IC CO., LTD.
Reel/Frame 061658/0715 →