IP Library › Assignment 059168/0448
Patent Assignment
Reel/Frame 059168/0448

Assignment of Assignor's Interest

Recorded: 2022-02-16 Pages: 5
Assignor
DIDREW TECHNOLOGY (BVI) LIMITED
Executed: 2022-01-27
Assignee
CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
12, SHANGYANG ST, HIGH TECH DISTRICT WEST, CHENGDU CITY, 611731, CHINA
Covered Properties (17)
Adhesive Composition for Temporary Bonding of Semiconductor Workpiece and Support Carrier Pair
Application: 16/297,394 →
Publication: US 2019/0276712
Embedded Driver IC(EmDIC) in LCD Display
Application: 62/599,568 →
Chip in Glass for LCD Display (LCDCiG)
Application: 62/613,717 →
No TIM Hermetic Flat top IHS/EMI shield
Application: 62/631,134 →
Large Panel Wafer Level Packaging Process
Application: 62/631,305 →
Glass frame fan out packaging
Application: 62/632,162 →
Method for Debonding Temporarily Adhesive-Bonded Carrier-Workpiece Pair by Using Chemical and Mechanical Means
Application: 15/916,263 →
Publication: US 2018/0264797
Method for Debonding Temporarily Adhesive-Bonded Carrier-Workpiece Pair by Using High Pressure Solvent
Application: 15/916,265 →
Publication: US 2018/0269077
SYSTEM AND METHOD OF EMBEDDING DRIVER IC (EmDIC) IN LCD DISPLAY SUBSTRATE
Application: 15/958,797 →
System and Method of Manufacturing Frameless Lcd Display
Application: 15/959,125 →
Molded Cavity Fanout Package Without Using a Carrier and Method of Manufacturing the Same
Application: 15/940,878 →
Hermetic Flat Top Integrated Heat Spreader (Ihs) / Electromagnetic Interference (Emi) Shield Package and Method of Manufacturing Thereof for Reducing Warpage
Application: 15/957,831 →
Publication: US 2019/0252324
Method of Debonding Work-Carrier Pair with Thin Devices
Application: 15/964,576 →
Publication: US 2019/0295877
Frameless Lcd Display with Embedded Ic System and Method of Manufacturing Thereof
Method of Manufacturing Fan Out Package with Carrier-Less Molded Cavity
Method of Simultaneously Fabricating Multiple Wafers on Large Carrier with Warpage Control Stiffener
System and Method of Fabricating Glass Frame Fan Out Packaging
Related Assignments (19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 3, 2018
From: SHEN, MINGHAO
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 045424/0573 →
Assignment of Assignor's Interest Apr 18, 2018
From: ZHANG, CHUNBIN
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 045580/0329 →
Assignment of Assignor's Interest Apr 18, 2018
From: ZHANG, CHUNBIN
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 045580/0321 →
Assignment of Assignor's Interest Apr 23, 2018
From: SHEN, MINGHAO; ZHOU, XIAOTIAN; HU, YINJIANG; ZOU, SHAOLIN
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 046450/0137 →
Assignment of Assignor's Interest Apr 23, 2018
From: SHEN, MINGHAO; ZHOU, XIAOTIAN; HU, YIJIANG; ZOU, SHAOLIN
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 046450/0123 →
Assignment of Assignor's Interest Apr 23, 2018
From: SHEN, MINGHAO
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 045613/0705 →
Assignment of Assignor's Interest Apr 27, 2018
From: ZHANG, CHUNBIN; ZHOU, XIAOTIAN
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 045654/0320 →
Assignment of Assignor's Interest Oct 1, 2018
From: SHEN, MINGHAO; DU, XIAOMING
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 047631/0306 →
Assignment of Assignor's Interest Oct 1, 2018
From: SHEN, MINGHAO
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 047172/0630 →
Assignment of Assignor's Interest Oct 1, 2018
From: SHEN, MINGHAO; ZHOU, XIAOTIAN
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 047172/0627 →
Assignment of Assignor's Interest Oct 1, 2018
From: SHEN, MINGHAO
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 047025/0862 →
Assignment of Assignor's Interest Nov 20, 2019
From: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.; BEIJING ESWIN TECHNOLOGY CO., LTD.
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
Reel/Frame 051071/0687 →
Assignment of Assignor's Interest Nov 27, 2019
From: DIDREW TECHNOLOGY (BVI) LIMITED
To: BEIJING ESWIN TECHNOLOGY CO., LTD.
Reel/Frame 051129/0751 →
Assignment of Assignor's Interest Nov 27, 2019
From: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.; BEIJING ESWIN TECHNOLOGY CO., LTD.
Reel/Frame 051129/0827 →
Assignment of Assignor's Interest Nov 27, 2019
From: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.; BEIJING ESWIN TECHNOLOGY CO., LTD.
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
Reel/Frame 051143/0435 →
Assignment of Assignor's Interest Jan 27, 2022
From: DIDREW TECHNOLOGY (BVI) LIMITED
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
Reel/Frame 058795/0321 →
Assignment of Assignor's Interest Nov 4, 2022
From: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
To: CHENGDU ESWIN SYSTEM IC CO., LTD.
Reel/Frame 061658/0715 →
License Jun 10, 2024
From: ZHANG, CHUNBIN
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 067676/0579 →
Corrective Assignment to Correct the Conveying and Receiving Party Data Previously Recorded at Reel: 67676 Frame: 579. Assignor(S) Hereby Confirms the License. Apr 21, 2025
From: DIDREW TECHNOLOGY (BVI) LIMITED
To: ZHANG, CHUNBIN
Reel/Frame 070903/0347 →