Patent Assignment
Reel/Frame 045424/0573
Assignment of Assignor's Interest
Recorded: 2018-04-03
Pages: 4
Assignor
SHEN, MINGHAO
Executed: 2018-03-29
Assignee
DIDREW TECHNOLOGY (BVI) LIMITED
2880 ZANKER ROAD, SUITE 210, SANTA CLARA, CALIFORNIA, 95134
Covered Property
(1)
Molded Cavity Fanout Package Without Using a Carrier and Method of Manufacturing the Same
Patent:
10,347,509 →
Application:
15/940,878 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 27, 2022
From: DIDREW TECHNOLOGY (BVI) LIMITED
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
Reel/Frame 058795/0321 →
Assignment of Assignor's Interest
Feb 16, 2022
From: DIDREW TECHNOLOGY (BVI) LIMITED
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
Reel/Frame 059168/0448 →
Assignment of Assignor's Interest
Nov 4, 2022
From: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
To: CHENGDU ESWIN SYSTEM IC CO., LTD.
Reel/Frame 061658/0715 →