Patent Assignment
Reel/Frame 045580/0321
Assignment of Assignor's Interest
Recorded: 2018-04-18
Pages: 2
Assignor
ZHANG, CHUNBIN
Executed: 2018-04-16
Assignee
DIDREW TECHNOLOGY (BVI) LIMITED
2880 ZANKER ROAD, SUITE 210, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Method for Debonding Temporarily Adhesive-Bonded Carrier-Workpiece Pair by Using Chemical and Mechanical Means
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 27, 2022
From: DIDREW TECHNOLOGY (BVI) LIMITED
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
Reel/Frame 058795/0321 →
Assignment of Assignor's Interest
Feb 16, 2022
From: DIDREW TECHNOLOGY (BVI) LIMITED
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
Reel/Frame 059168/0448 →
Assignment of Assignor's Interest
Nov 4, 2022
From: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
To: CHENGDU ESWIN SYSTEM IC CO., LTD.
Reel/Frame 061658/0715 →
License
Jun 10, 2024
From: ZHANG, CHUNBIN
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 067676/0579 →
Corrective Assignment to Correct the Conveying and Receiving Party Data Previously Recorded at Reel: 67676 Frame: 579. Assignor(S) Hereby Confirms the License.
Apr 21, 2025
From: DIDREW TECHNOLOGY (BVI) LIMITED
To: ZHANG, CHUNBIN
Reel/Frame 070903/0347 →