Patent Assignment
Reel/Frame 046450/0137
Assignment of Assignor's Interest
Recorded: 2018-04-23
Pages: 4
Assignors
SHEN, MINGHAO
Executed: 2018-04-23
ZHOU, XIAOTIAN
Executed: 2018-04-23
HU, YINJIANG
Executed: 2018-04-22
ZOU, SHAOLIN
Executed: 2018-04-22
Assignee
DIDREW TECHNOLOGY (BVI) LIMITED
2880 ZANKER ROAD, SUITE 210, SANTA CLARA, CALIFORNIA, 95134
Covered Property
(1)
Hermetic Flat Top Integrated Heat Spreader (Ihs) / Electromagnetic Interference (Emi) Shield Package and Method of Manufacturing Thereof for Reducing Warpage
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 27, 2022
From: DIDREW TECHNOLOGY (BVI) LIMITED
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
Reel/Frame 058795/0321 →
Assignment of Assignor's Interest
Feb 16, 2022
From: DIDREW TECHNOLOGY (BVI) LIMITED
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
Reel/Frame 059168/0448 →
Assignment of Assignor's Interest
Nov 4, 2022
From: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
To: CHENGDU ESWIN SYSTEM IC CO., LTD.
Reel/Frame 061658/0715 →