IP Library › Assignment 051143/0435
Patent Assignment
Reel/Frame 051143/0435

Assignment of Assignor's Interest

Recorded: 2019-11-27 Pages: 5
Assignors
BEIJING ESWIN TECHNOLOGY CO., LTD.
Executed: 2019-11-12
Assignee
CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
NO. 12, SHANGYANG ST.,, HIGH TECH DISTRICT WEST, CHENGDU CITY, 611731, CHINA
Covered Property (1)
Method of Debonding Work-Carrier Pair with Thin Devices
Application: 15/964,576 →
Publication: US 2019/0295877
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 27, 2018
From: ZHANG, CHUNBIN; ZHOU, XIAOTIAN
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 045654/0320 →
Assignment of Assignor's Interest Nov 27, 2019
From: DIDREW TECHNOLOGY (BVI) LIMITED
To: BEIJING ESWIN TECHNOLOGY CO., LTD.
Reel/Frame 051129/0751 →
Assignment of Assignor's Interest Nov 27, 2019
From: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.; BEIJING ESWIN TECHNOLOGY CO., LTD.
Reel/Frame 051129/0827 →
Assignment of Assignor's Interest Jan 27, 2022
From: DIDREW TECHNOLOGY (BVI) LIMITED
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
Reel/Frame 058795/0321 →
Assignment of Assignor's Interest Feb 16, 2022
From: DIDREW TECHNOLOGY (BVI) LIMITED
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
Reel/Frame 059168/0448 →
Assignment of Assignor's Interest Nov 4, 2022
From: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
To: CHENGDU ESWIN SYSTEM IC CO., LTD.
Reel/Frame 061658/0715 →