IP Library › Assignment 051129/0827
Patent Assignment
Reel/Frame 051129/0827

Assignment of Assignor's Interest

Recorded: 2019-11-27 Pages: 6
Assignor
Assignees
CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
NO. 12, SHANGYANG ST., HIGH TECH DISTRICT WEST, CHENGDU CITY, 611731, CHINA
BEIJING ESWIN TECHNOLOGY CO., LTD.
NO. 99, KECHUANG 14TH ST., BEIJING ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ARE, BEIJING CITY, 611731, CHINA
Covered Property (1)
Method of Debonding Work-Carrier Pair with Thin Devices
Application: 15/964,576 →
Publication: US 2019/0295877
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 27, 2018
From: ZHANG, CHUNBIN; ZHOU, XIAOTIAN
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 045654/0320 →
Assignment of Assignor's Interest Nov 27, 2019
From: DIDREW TECHNOLOGY (BVI) LIMITED
To: BEIJING ESWIN TECHNOLOGY CO., LTD.
Reel/Frame 051129/0751 →
Assignment of Assignor's Interest Nov 27, 2019
From: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.; BEIJING ESWIN TECHNOLOGY CO., LTD.
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
Reel/Frame 051143/0435 →
Assignment of Assignor's Interest Jan 27, 2022
From: DIDREW TECHNOLOGY (BVI) LIMITED
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
Reel/Frame 058795/0321 →
Assignment of Assignor's Interest Feb 16, 2022
From: DIDREW TECHNOLOGY (BVI) LIMITED
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
Reel/Frame 059168/0448 →
Assignment of Assignor's Interest Nov 4, 2022
From: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
To: CHENGDU ESWIN SYSTEM IC CO., LTD.
Reel/Frame 061658/0715 →