Patent Assignment
Reel/Frame 051129/0751
Assignment of Assignor's Interest
Recorded: 2019-11-27
Pages: 4
Assignor
DIDREW TECHNOLOGY (BVI) LIMITED
Executed: 2018-10-25
Assignee
BEIJING ESWIN TECHNOLOGY CO., LTD.
NO. 12, SHANGYANG ST., HIGH TECH DISTRICT WEST, HIGH TECH DISTRICT WEST, CHENGDU CITY, 611731, CHINA
Covered Property
(1)
Method of Debonding Work-Carrier Pair with Thin Devices
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 27, 2018
From: ZHANG, CHUNBIN; ZHOU, XIAOTIAN
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 045654/0320 →
Assignment of Assignor's Interest
Nov 27, 2019
From: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.; BEIJING ESWIN TECHNOLOGY CO., LTD.
Reel/Frame 051129/0827 →
Assignment of Assignor's Interest
Nov 27, 2019
From: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.; BEIJING ESWIN TECHNOLOGY CO., LTD.
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
Reel/Frame 051143/0435 →
Assignment of Assignor's Interest
Jan 27, 2022
From: DIDREW TECHNOLOGY (BVI) LIMITED
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
Reel/Frame 058795/0321 →
Assignment of Assignor's Interest
Feb 16, 2022
From: DIDREW TECHNOLOGY (BVI) LIMITED
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
Reel/Frame 059168/0448 →
Assignment of Assignor's Interest
Nov 4, 2022
From: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
To: CHENGDU ESWIN SYSTEM IC CO., LTD.
Reel/Frame 061658/0715 →