IP Library › Assignment 051071/0687
Patent Assignment
Reel/Frame 051071/0687

Assignment of Assignor's Interest

Recorded: 2019-11-20 Pages: 4
Assignors
BEIJING ESWIN TECHNOLOGY CO., LTD.
Executed: 2019-11-12
Assignee
CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
NO. 12, SHANGYANG ST., HIGH TECH DISTRICT WEST, CHENGDU CITY, 611731, CHINA
Covered Property (1)
Adhesive Composition for Temporary Bonding of Semiconductor Workpiece and Support Carrier Pair
Application: 16/297,394 →
Publication: US 2019/0276712
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 27, 2022
From: DIDREW TECHNOLOGY (BVI) LIMITED
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
Reel/Frame 058795/0321 →
Assignment of Assignor's Interest Feb 16, 2022
From: DIDREW TECHNOLOGY (BVI) LIMITED
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
Reel/Frame 059168/0448 →
Assignment of Assignor's Interest Nov 4, 2022
From: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
To: CHENGDU ESWIN SYSTEM IC CO., LTD.
Reel/Frame 061658/0715 →