IP Library › Assignment 045353/0115
Patent Assignment
Reel/Frame 045353/0115

Assignment of Assignor's Interest

Recorded: 2018-03-26 Pages: 4
Assignors
SHEN, MINGHAO
Executed: 2018-03-23
ZHOU, XIAOTIAN
Executed: 2018-03-23
Assignee
DIDREW TECHNOLOGY (BVI) LIMITED
2880 ZANKER ROAD, SUITE 210, SANTA CLARA, CALIFORNIA, 95134
Covered Property (1)
Multiple Wafers Fabrication Technique on Large Carrier with Warpage Control Stiffener
Application: 15/934,080 →
Publication: US 2019/0252278
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 2, 2018
From: DIDREW TECHNOLOGY (BVI) LIMITED
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
Reel/Frame 047398/0987 →
Assignment of Assignor's Interest Feb 21, 2019
From: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.; BEIJING ESWIN TECHNOLOGY CO., LTD.
Reel/Frame 048402/0107 →
Assignment of Assignor's Interest Nov 19, 2019
From: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.; BEIJING ESWIN TECHNOLOGY CO., LTD.
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
Reel/Frame 051058/0408 →
Assignment of Assignor's Interest Nov 4, 2022
From: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
To: CHENGDU ESWIN SYSTEM IC CO., LTD.
Reel/Frame 061658/0715 →