EMBEDDED MOLDING FAN-OUT (EMFO) PACKAGING AND METHOD OF MANUFACTURING THEREOF
Embedded molding fan-out (eMFO) packaging technology has the benefit of delivering six-sided protection of a semiconductor device to reduce delamination failures and provide better reliability and performance. Additionally, semiconductor devices utilizing eMFO packaging technology need not worry about dielectric transition planarity issues, or having to use expensive copper posts or pillars or an extra dielectric layer. In short, implementation of eMFO packaging technology means lower manufacturing cost and better overall performance.
1 . A system comprising:
a semiconductor substrate having a semiconductor device with an active region and a sacrificial structure formed on the active region;
a carrier substrate having an adhesive layer, wherein the semiconductor substrate is disposed on the carrier substrate with the semiconductor substrate in contact with the adhesive layer;
an encapsulation material at least partially encapsulating the semiconductor substrate and a portion of the active region, wherein an upper surface of the encapsulation material is coplanar with an upper surface of the sacrificial structure; and
a redistribution layer (RDL) structure formed over the upper surface of the encapsulation material, after removal of the sacrificial structure, wherein at least a portion of the RDL structure is in electrical contact with the active region of the semiconductor device, the RDL structure without a non-conformal metal structure.
2 . The system of claim 1 , wherein the semiconductor substrate is removed from the carrier substrate to form the semiconductor device.
3 . The system of claim 2 , further comprising an insulating layer encapsulating the semiconductor substrate and at least a portion of the encapsulation material, wherein the insulating layer is coplanar with the semiconductor substrate and a lower surface of the encapsulation material.
4 . The system of claim 1 , wherein the sacrificial structure is formed from at least one of photo-sensitive polymers, non-photo-sensitive polymers, positive photoresists, negative photoresists, photo-imageable dielectric (PID) material, non-photo-imageable dielectric materials, benzocyclobutene (BCB), polybenzoxazoles (PBO), polyimide (PI), and heat-resistant thermoplastics.
5 . The system of claim 1 , wherein the RDL structure includes only a single dielectric layer.
6 . The system of claim 1 , wherein the non-conformal metal structure includes a fill-up metal post or pillar.
7 . A method comprising:
(a) providing a semiconductor substrate having a semiconductor device with an active region and a sacrificial structure formed on the active region;
(b) providing a carrier substrate having an adhesive layer;
(c) mounting the semiconductor substrate over the carrier substrate, wherein the semiconductor substrate is in contact with the adhesive layer;
(d) encapsulating at least a portion of the semiconductor substrate and the sacrificial structure with an encapsulation material, wherein an upper surface of the encapsulation material is coplanar with an upper surface of the sacrificial structure;
(e) removing the sacrificial structure exposing the active region of the semiconductor device; and
(f) forming a redistribution layer (RDL) structure over the semiconductor device, wherein at least a portion of the RDL structure is in electrical contact with the active region of the semiconductor device.
8 . The method of claim 7 , further comprising:
(g) removing the semiconductor substrate from the carrier substrate to form the semiconductor device.
9 . The method of claim 8 , further comprising:
(h) encapsulating the semiconductor substrate and at least a portion of the encapsulation material with an insulating layer, wherein the insulating layer is coplanar with the semiconductor substrate and a lower surface of the encapsulation material.
10 . The method of claim 7 , wherein the providing step (a) includes forming the sacrificial structure from at least one of photo-sensitive polymers, non-photo-sensitive polymers, positive photoresists, negative photoresists, photo-imageable dielectric (PID) material, non-photo-imageable dielectric materials, benzocyclobutene (BCB), polybenzoxazoles (PBO), polyimide (PI), and heat-resistant thermoplastics.
11 . The method of claim 7 , wherein the encapsulating step (d) includes planarizing the upper surface of the encapsulation material to be coplanar with the upper surface of the sacrificial structure via a planarizing process.
12 . The method of claim 7 , wherein the removing step (e) includes removing the sacrificial structure with at least one of dry etch and wet etch processing.
13 . The method of claim 7 , wherein the forming step (f) includes forming the RDL structure without a non-conformal metal structure.
14 . The method of claim 13 , wherein the non-conformal metal structure includes a fill-up metal post or pillar.
15 . A method comprising:
(a) providing a semiconductor substrate having a semiconductor device with an active region and a sacrificial structure formed on the active region;
(b) providing a carrier substrate having an adhesive layer;
(c) mounting the semiconductor substrate over the carrier substrate, wherein the semiconductor substrate is in contact with the adhesive layer;
(d) encapsulating at least a portion of the semiconductor substrate and the sacrificial structure with an encapsulation material, wherein an upper surface of the encapsulation material is coplanar with an upper surface of the sacrificial structure;
(e) removing the sacrificial structure exposing the active region of the semiconductor device;
(f) forming a redistribution layer (RDL) structure over the semiconductor device, wherein at least a portion of the RDL structure is in electrical contact with the active region of the semiconductor device;
(g) removing the semiconductor substrate from the carrier substrate to form the semiconductor device; and
(h) encapsulating the semiconductor substrate and at least a portion of the encapsulation material with an insulating layer, wherein the insulating layer is coplanar with the semiconductor substrate and a lower surface of the encapsulation material.
16 . The method of claim 15 , wherein the providing step (a) includes forming the sacrificial structure from at least one of photo-sensitive polymers, non-photo-sensitive polymers, positive photoresists, negative photoresists, photo-imageable dielectric (PID) material, non-photo-imageable dielectric materials, benzocyclobutene (BCB), polybenzoxazoles (PBO), polyimide (PI), and heat-resistant thermoplastics.
17 . The method of claim 15 , wherein the encapsulating step (d) includes planarizing the surface of the encapsulation material to be coplanar with the upper surface of the sacrificial structure via a planarizing process.
18 . The method of claim 15 , wherein the removing step (e) includes removing the sacrificial structure with at least one of dry etch and wet etch processing.
19 . The method of claim 15 , wherein the forming step (f) includes forming the RDL structure without a non-conformal metal structure.
20 . The method of claim 19 , wherein the non-conformal metal structure includes a fill-up metal post or pillar.