Patent Assignment
Reel/Frame 052199/0103
Assignment of Assignor's Interest
Recorded: 2020-03-23
Pages: 4
Assignee
DIDREW TECHNOLOGY (BVI) LIMITED
VISTA CORPORATE SERVICES CENTRE, WICKHAMS CAY II, ROAD TOWN, TORTOLA, VG1110, VIRGIN ISLANDS, BRITISH
Covered Property
(1)
Embedded Molding Fan-Out (Emfo) Packaging and Method of Manufacturing Thereof
Application:
16/817,388 →
Publication:
US 2021/0287953
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 21, 2022
From: DIDREW TECHNOLOGY (BVI) LIMITED
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
Reel/Frame 060264/0536 →
Assignment of Assignor's Interest
Nov 4, 2022
From: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
To: CHENGDU ESWIN SYSTEM IC CO., LTD.
Reel/Frame 061658/0715 →