Patent Assignment
Reel/Frame 060264/0536
Assignment of Assignor's Interest
Recorded: 2022-06-21
Pages: 4
Assignor
DIDREW TECHNOLOGY (BVI) LIMITED
Executed: 2022-06-17
Assignee
CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
12, SHANGYANG ST. HIGH TECH DISTRICT, WEST CHENGDU CITY, 611731, CHINA
Covered Properties
(2)
Embedded Molding Fan-Out (Emfo) Packaging and Method of Manufacturing Thereof
Application:
16/817,388 →
Publication:
US 2021/0287953
Interposer Structure Containing Embedded Silicon-Less Link Chiplet
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 23, 2020
From: SHEN, MINGHAO; ZHOU, XIAOTIAN
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 052199/0103 →
Assignment of Assignor's Interest
Mar 22, 2021
From: SHEN, MINGHAO
To: DIDREW TECHNOLOGY (BVI) LIMITED
Reel/Frame 055665/0734 →
Assignment of Assignor's Interest
Nov 4, 2022
From: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
To: CHENGDU ESWIN SYSTEM IC CO., LTD.
Reel/Frame 061658/0715 →