Patent Assignment
Reel/Frame 055665/0734
Assignment of Assignor's Interest
Recorded: 2021-03-22
Pages: 3
Assignor
SHEN, MINGHAO
Executed: 2021-03-15
Assignee
DIDREW TECHNOLOGY (BVI) LIMITED
30 DE CASTRO STREET, WICKHAMS CAY, 1, PO BOX 4519, ROAD TOWN, TORTOLA, VIRGIN ISLANDS, BRITISH
Covered Property
(1)
Interposer Structure Containing Embedded Silicon-Less Link Chiplet
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 21, 2022
From: DIDREW TECHNOLOGY (BVI) LIMITED
To: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
Reel/Frame 060264/0536 →
Assignment of Assignor's Interest
Nov 4, 2022
From: CHENGDU ESWIN SIP TECHNOLOGY CO., LTD.
To: CHENGDU ESWIN SYSTEM IC CO., LTD.
Reel/Frame 061658/0715 →