Patent Assignment
Reel/Frame 047276/0466
Assignment of Assignor's Interest
Recorded: 2018-10-23
Pages: 8
Assignors
HUANG, SIN-YAO
Executed: 2017-04-06
WANG, CHING-CHUN
Executed: 2017-03-15
YAUNG, DUN-NIAN
Executed: 2017-02-23
HUNG, FENG-CHI
Executed: 2017-03-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Via Support Structure Under Pad Areas for Bsi Bondability Improvement