Patent Assignment
Reel/Frame 047321/0948
Assignment of Assignor's Interest
Recorded: 2018-10-25
Pages: 4
Assignors
LIANG, FANG-YU
Executed: 2018-10-09
YANG, CHING-FENG
Executed: 2018-10-09
WU, KAI-CHIANG
Executed: 2018-10-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Semicondcutor Package and Manufacturing Method of Semicondcutor Package