Patent Assignment
Reel/Frame 047322/0424
Assignment of Assignor's Interest
Recorded: 2018-10-26
Pages: 4
Assignors
CHEN, WEI-TING
Executed: 2018-09-11
TSAI, CHUNG-HAO
Executed: 2018-09-11
YU, CHEN-HUA
Executed: 2018-09-14
WANG, CHUEI-TANG
Executed: 2018-09-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structure, Package Structure, and Manufacturing Method Thereof