Patent Assignment
Reel/Frame 047373/0191
Assignment of Assignor's Interest
Recorded: 2018-10-31
Pages: 2
Assignor
HAN, KWON WHAN
Executed: 2018-10-17
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Fabricating Semiconductor Packages Including Reinforcement Top Die