Patent Assignment
Reel/Frame 047387/0741
Assignment of Assignor's Interest
Recorded: 2018-11-01
Pages: 2
Assignors
CHEN, CHING-YI
Executed: 2018-10-19
LOH, WEI-YIP
Executed: 2018-10-19
CHEN, HUNG-HSU
Executed: 2018-10-19
CHANG, CHIH-WEI
Executed: 2018-10-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Treatment for Adhesion Improvement