Patent Assignment
Reel/Frame 047423/0702
Assignment of Assignor's Interest
Recorded: 2018-11-06
Pages: 5
Assignors
TOLENTINO, ERIK NINO
Executed: 2018-10-19
CHEW, CHEE HIONG
Executed: 2018-10-19
LIN, YUSHENG
Executed: 2018-11-06
KHOR, SWEE HAR
Executed: 2018-10-19
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Reinforced Semiconductor Die and Related Methods
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Feb 13, 2019
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 048327/0670 →
Release of Security Interest in Patents Recorded at Reel 048327, Frame 0670
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064079/0001 →