Patent Assignment
Reel/Frame 047423/0820
Assignment of Assignor's Interest
Recorded: 2018-11-06
Pages: 4
Assignors
JENG, SHIN-PUU
Executed: 2018-10-26
WONG, TECHI
Executed: 2018-10-25
LIN, PO-YAO
Executed: 2018-10-26
YEW, MING-CHIH
Executed: 2018-10-25
TSAI, PO-HAO
Executed: 2018-10-25
CHUANG, PO-YAO
Executed: 2018-10-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Forming Chip Package Structure