Patent Assignment
Reel/Frame 047433/0901
Assignment of Assignor's Interest
Recorded: 2018-11-07
Pages: 4
Assignors
JENG, SHIN-PUU
Executed: 2018-11-01
LIN, PO-YAO
Executed: 2018-10-26
HSU, FENG-CHENG
Executed: 2018-10-26
CHEN, SHUO-MAO
Executed: 2018-10-26
WANG, CHIN-HUA
Executed: 2018-10-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure with Lid and Method for Forming the Same