Patent Assignment
Reel/Frame 047481/0586
Assignment of Assignor's Interest
Recorded: 2018-11-13
Pages: 6
Assignors
YOSHIDA, YUKA
Executed: 2018-08-10
TANAKA, KENJI
Executed: 2018-08-10
KATAGI, HIDEYUKI
Executed: 2018-08-20
AMANO, YOSHIHIRO
Executed: 2018-08-23
KOSUGI, SHINICHI
Executed: 2018-09-11
SUE, HARUAKI
Executed: 2018-09-13
TAKEZAWA, YOSHITAKA
Executed: 2018-08-20
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Epoxy Resin Composition, Semi-Cured Epoxy Resin Composition, Cured Epoxy Resin Composition, Molded Article, and Cured Molded Article
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Dec 22, 2020
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 054825/0019 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →