Patent Assignment
Reel/Frame 054825/0019
Change of Name
Recorded: 2020-12-22
Pages: 32
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 20037-1164, JAPAN
Covered Property
(1)
Epoxy Resin Composition, Semi-Cured Epoxy Resin Composition, Cured Epoxy Resin Composition, Molded Article, and Cured Molded Article
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 13, 2018
From: YOSHIDA, YUKA; TANAKA, KENJI; KATAGI, HIDEYUKI; AMANO, YOSHIHIRO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 047481/0586 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →