Patent Assignment
Reel/Frame 047511/0319
Assignment of Assignor's Interest
Recorded: 2018-11-13
Pages: 2
Assignor
UMEZAWA, JO
Executed: 2018-10-26
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, 1080075, JAPAN
Covered Property
(1)
Metal Frame, Dummy Wafer, Semiconductor Device, Electronic Device, and Method of Manufacturing Semiconductor Device