Patent Assignment
Reel/Frame 047522/0018
Assignment of Assignor's Interest
Recorded: 2018-11-16
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2018-11-06
WU, CHIH-WEI
Executed: 2018-11-06
SHIH, YING-CHING
Executed: 2018-11-06
LU, SZU-WEI
Executed: 2018-11-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Package and Method of Forming Same
Patent:
10,529,637 →
Application:
16/176,008 →