Patent Assignment
Reel/Frame 047523/0626
Assignment of Assignor's Interest
Recorded: 2018-08-23
Pages: 2
Assignor
TABATA, MASAHIRO
Executed: 2018-06-20
Assignee
TOKYO ELECTRON LIMITED
3-1, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Method and Apparatus for Processing Substrate