IP Library Assignment 047526/0631
Patent Assignment
Reel/Frame 047526/0631

Assignment of Assignor's Interest

Recorded: 2018-11-16 Pages: 3
Assignor
WOERTINK, JULIA
Executed: 2015-09-15
Assignee
DOW GLOBAL TECHNOLOGIES LLC
2040 DOW CENTER, MIDLAND, MICHIGAN, 48674
Covered Property (1)
Method of Electroplating Photoresist Defined Features from Copper Electroplating Baths Containing Reaction Products of Imidazole and Bisepoxide Compounds
Application: 15/220,467 →
Publication: US 2017/0037526
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 7, 2019
From: THORSETH, MATTHEW A.; NIAZIMBETOVA, ZUHRA; QIN, YI; DZIEWISZEK, JOANNA
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 047921/0940 →
Assignment of Assignor's Interest Sep 17, 2024
From: DOW GLOBAL TECHNOLOGIES LLC
To: THE DOW CHEMICAL COMPANY
Reel/Frame 068971/0226 →
Assignment of Assignor's Interest Sep 17, 2024
From: THE DOW CHEMICAL COMPANY
To: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
Reel/Frame 068971/0362 →
Change of Legal Entity Sep 17, 2024
From: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
To: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
Reel/Frame 068972/0210 →
Security Interest Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
Security Interest Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →